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    Mea Optical / Packaging Process of Optical Device ʻAʻole ʻoe i ʻike-SMD

    Ka manawa hoʻouna: Dec-06-2019

    ʻO ka hana mua i ke kaʻina hana o ka loaʻa ʻana o kahi chip paha ka patch;Aia i loko o ka TO kahi ʻāpana e hoʻomoe ana i ka wela i ke kumu TO, kahi puʻupuʻu e LD i ka wela wela, a me ke kukui hope PD;

    He ʻokoʻa loa paha ke kaʻina hana kau ʻana: ʻo ka mea e hoʻopili ʻia he pahu LD / PD, a i ʻole TIA, resistor / capacitor;hiki ke hoʻokomo ʻia ma kahi alumini nitride heat sink a i ʻole pololei ma ka PCB;hiki ke hoʻohana i ka hoʻokomo Eutectic welding a i ʻole conductive adhesive;hiki i ka patch ke koi wale i nā ʻumi a i ʻole nā ​​haneli o nā microns o ka pololei, e like me TIA, nā mea pale, a me ka pololei sub-micron, e like me ka hoʻoheheʻe ʻana i ka flip-chip passive.

    001

    Ma hope o ka ʻōlelo ʻana i kēia mau mea, he aha ke ʻano o ka patch?ʻAʻohe mea i ʻike ʻia he wehewehe maʻamau.Eia naʻe, hiki ke ʻike ʻia mai nā hiʻohiʻona ma luna aʻe he mea like lākou: hoʻohana ʻia ka hāmeʻa e kau a hoʻoponopono i ke kino hoʻokomo ma luna o ka mea lawe me ka pololei e hoʻokō i kahi hana kikoʻī.(No ke aha e hoʻohana ai i nā mea hana? Manaʻo wau ua kapa ʻia ke kaʻina hoʻokomo i hiki ke hoʻomaʻamaʻa ʻia he patch, inā ʻaʻole hiki ke kapa ʻia ʻo ka hoʻopaʻa lima lima wale nō.) Ma muli o kēia manaʻo maʻamau, ua hōʻuluʻulu au i ʻehā mau mea nui o kahi pā: ke kino hoʻokomo, ka lawe lawe , Keʻano paʻa, pololei.A he aha ka mea lawe i hoʻohana ʻia, he aha ka solder i koho ʻia, a he aha nā koi kūpono, pili ia i ka hana e pono ai ka mea e kau ʻia.

    002

    Eia ka nānā ʻana i nā mea like ʻole i loko o nā mea ʻehā o ka patch.

    ʻO ka hapa nui o nā mauna he mau pahu LD a me PD.

    TIA / Keaukaha / Resistor / Capacitors, e like me nā kino hoʻokomo ʻaʻole koi i ka pololei kiʻekiʻe, hiki ke hoʻololi lima ʻia ma kahi o nā puke nui.

    003

    ʻO ka mea lawe maʻamau ʻo AIN heat sink;me ka hoʻomohala ʻana i nā ʻāpana i hoʻohui ʻia, ua lilo pū nā ʻāpana PLC a me nā ʻāpana optical silicon i nā kino kau ʻana maʻamau, e like me ke kukui silicon grating coupling chips, kahi e pono ai ke kau ʻia ʻo LaMP ma nā ʻāpana optical silicon;ʻO ka PCB nā mea lawe maʻamau i nā pūʻolo COB, e like me ke kamaʻilio ʻikepili 100G-SR4 modules, PD / VSCEL i kau pololei ʻia ma ka PCB.

    004

    005

     

    ʻO Au80Sn20 alloy he LD-mauna eutectic solder maʻamau.Hoʻohana pinepine ʻia ka conductive adhesive e kau i ka PD.ʻOi aku ka maikaʻi o ka lens paʻa paʻa UV.

    006

    ʻO ka pololei ma muli o ka noi kikoʻī;

    Ma kahi e pono ai ka hoʻopili ʻana i ke ala optical, ʻoi aku ka kiʻekiʻe o ke koi pololei.

    Pono ka pololei ʻoi aku ka pololei ma mua o ka hoʻohui ʻana.

    Pono ka hoʻokomo LD i ka pololei ma mua o ka hoʻokomo PD,

    ʻAʻole pono ʻo TIA / resistor / capacitor i kahi kikoʻī, e hoʻopili wale.

    007

    Kaʻina hoʻokomo maʻamau

    Pākuʻi solder eutectic gula-tin

    008

    Pākuʻi hoʻopololei

    009

    Ma kahi ʻaʻole kiʻekiʻe ka pololei, pono ʻoe e nānā i lalo i ka CCD e kiʻi i nā kiʻi o ka chip a me ka substrate i ka manawa like, a hoʻohana i nā kaha alignment a i ʻole nā ​​ʻaoʻao chip e align.

    010

    No nā noi flip-chip, koi ʻia nā CCD he nui, e nānā ana i ka lalo o ka chip a me ka ʻili o ka substrate.Pono pū nā noi kiʻekiʻe i nā kaha alignment kūikawā.

    011



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