Talaabada ugu horeysa ee habka helitaanka chip waxay noqon kartaa balastar;a TO ay ku jiraan balastar kuleylku dego godka TO, jib LDs ilaa saxanka kulaylka, iyo PD nalka danbe;
Habka rakibida gaarka ah ayaa laga yaabaa inuu aad u kala duwan yahay: shayga lagu dhejinayo badanaa waa LD / PD chip, ama TIA, resistor / capacitor;meelaynta waxaa lagu samayn karaa weelka kulaylka nitride aluminium ama si toos ah PCB-ga;meelaynta alxanka Eutectic ama koollada korantada ayaa la isticmaali karaa;balastarku waxa uu u baahan karaa oo kaliya tobanaan ama xitaa boqolaal microns sax ah, sida TIA, resistors, iyo saxnaanta sub-micron, sida alxanka flip-chip dadban.
Markaan waxan oo dhan idhi, waa maxay balastar?Marna uma eka inay jirto qeexitaan heersare ah.Si kastaba ha ahaatee, waxaa laga arki karaa tusaalooyinka kor ku xusan in ay leeyihiin hal shay oo caadi ah: qalabka waxaa loo isticmaalaa in lagu meeleeyo oo lagu hagaajiyo jirka meelaynta ee sideeeyaha oo leh saxsanaan gaar ah si loo gaaro shaqo gaar ah.(Maxaa loo isticmaalayaa qalabka? Waxaan u malaynayaa habka meelaynta ee si toos ah loo samayn karo waxaa loo yaqaan patch, haddii kale waxaa la odhan karaa oo kaliya bonding manual). side , Habka go'an, saxnaanta.Iyo waxa sidaha loo isticmaalo, alxanka la doortay, iyo waxa shuruudaha saxda ah ay yihiin, waxay gebi ahaanba ku xidhan tahay shaqada uu u baahan yahay shayga lagu rakibay si uu u gaaro.
Halkan fiiri fursadaha kala duwan ee ku jira afarta walxood ee balastarka:
Inta badan xirmooyinka waa LD iyo PD chips.
TIA / Driver / Resistor / Capacitors, sida meelaynta ee aan u baahnayn saxnaanta sare, gacanta ayaa lagu bedeli karaa halkii mug weyn.
Siday dhaqameedka ugu badan waa AIN kulaylka;iyadoo la horumarinayo chips-ka isku-dhafan, chips-yada PLC iyo chips-yada silikoon waxay sidoo kale noqdeen unugyo kor u kaca oo caadi ah, sida silikoon nalalka isku-xidhka isku-xidhka, kuwaas oo u baahan in LaMP lagu dhejiyo chips-ka silikoon indhaha;PCB waa sideyaal caadi ah oo ku jira xirmooyinka COB, sida isgaarsiinta xogta 100G-SR4 modules, PD/VSCEL waxay si toos ah ugu rakiban yihiin PCB-ga.
Au80Sn20 alloy waa alxanka LD-Moon ee caadiga ah.Xabagta waxtarka leh ayaa badanaa loo isticmaalaa in lagu dhejiyo PD.Xabagta UV ee muraayadaha go'an ayaa aad ugu habboon.
Saxnimadu waxay ku xidhan tahay codsi gaar ah;
Halka loo baahan yahay isku xidhka dariiqyada indhaha, shuruudaha saxnaanta ayaa ah mid aad u sarreeya.
Toosinta dadban waxay u baahantahay saxnaan sare marka loo eego isku xidhka firfircoon.
Meelaynta LD waxay u baahan tahay saxsanaan ka sareeya meelaynta PD,
TIA / resistor / capacitor uma baahna wax sax ah, kaliya ku dheji.
Habka meelaynta guud
Alxanka dahabka ah ee eutectic
Xirmooyinka koollada ee waxtarka leh
Meesha saxnidu aanay sarrayn, waxa aad u baahan tahay oo kaliya in aad hoos u eegto CCD si aad u qabsato sawirada jajabka iyo substrate-ka isku mar, oo aad isticmaasho calaamado toosan ama geesaha jajabka si aad isugu toosiso
Codsiyada rogrogmi kara, CCD-yo badan ayaa sidoo kale loo baahan yahay, iyaga oo eegaya labadaba gunta hoose ee jajabka iyo dusha sare ee substrate-ka.Codsiyada saxda ah ee saxda ah waxay sidoo kale u baahan yihiin calaamado toosin gaar ah.
