Kunyatsojeka kwebhodhi redunhu kunoreva kushandiswa kwehupamhi hwemutsara wehupamhi / nzvimbo, maburi madiki, hupamhi hwemhete mhete (kana kuti isina mhete yakafara), uye akavigwa uye mapofu maburi kuti awane yakakwira density.
Iyo yakanyanya kurongeka inoreva mhedzisiro ye "yakaonda, diki, yakatetepa, yakatetepa" ichaunza zvisingadzivisiki zvinodikanwa zvakanyanya, kutora upamhi hwemutsara semuenzaniso: 0.20mm mutsara mutsara, maererano nemirairo yekugadzira 0.16 ~ 0.24mm sezvakakodzera, kukanganisa ndiko (0.20±0.04) mm;uye upamhi hwemutsara we0.10 mm, kukanganisa kuri (0.1±0.02) mm nenzira imwechete.Zviripachena kuti kurongeka kwekupedzisira kwakapetwa kaviri, uye zvichingodaro hazvina kuoma kunzwisisa, saka kunyatsojeka kunodiwa.
1.Fine wire technology
Mune ramangwana, iyo yakakwirira-density mutsara upamhi / nzvimbo ichabva pa 0.20mm kusvika 0.13mm kusvika 0.08mm kusvika 0.005mm kuzadzisa zvinodiwa zveSMT uye multi-chip package (Mulitichip Package, MCP).Naizvozvo, tekinoroji inotevera inodiwa:
①Kushandisa yakaonda kana yakanyanyisa-yakatetepa yemhangura foil (<18um) substrate uye yakanaka yepamusoro yekurapa tekinoroji.
②Kushandisa yakaonda yakaoma firimu uye yakanyorova lamination process, yakaonda uye yakanaka mhando yakaoma firimu inogona kuderedza mutsara wakafara kukanganisa uye kukanganisa.Firimu rakanyorova rinogona kuzadza iro diki mhepo gaka, kuwedzera interface adhesion, uye kunatsiridza waya kutendeseka uye chokwadi.
③Electrodeposited photoresist (ED) inoshandiswa.Ukobvu hwayo hunogona kudzorwa muhupamhi hwe5 ~ 30/um, iyo inogona kuburitsa yakanyanya kukwana waya dzakanaka.Iyo inonyanya kukodzera kune yakamanikana mhete hupamhi, isina mhete hupamhi uye yakazara-ndiro plating.Parizvino, kune anopfuura gumi mitsara yekugadzira ED munyika.
④Adopt parallel light exposure tekinoroji.Sezvo kuratidzwa kwechiedza chakafanana kunogona kukurira kukanganiswa kwemutsara wehupamhi hwekusiyana kunokonzerwa nechiedza che oblique che "point" chiedza chinobva, tambo yakanaka ine mutsara wakarurama uye mitsetse yakatsetseka inogona kuwanikwa.Nekudaro, iyo parallel exposure yemidziyo inodhura, inoda mari yakawanda, uye inoda kushanda munzvimbo ine hutsanana hwepamusoro.
⑤Adopt otomatiki yekuona tekinoroji.Iyi tekinoroji yave nzira yakakosha yekuona mukugadzirwa kwewaya dzakanaka uye iri kukurumidza kusimudzirwa, kushandiswa nekuvandudzwa.
2.Micropore teknolojia
Makomba anoshanda epamusoro-akaiswa mabhodhi akadhindwa anonyanya kushandiswa pakubatanidza magetsi, izvo zvinoita kuti kushandiswa kweiyo micro-hole tekinoroji kuve yakakosha.Iko kushandiswa kwezvinhu zvakajairwa zvekuboorera zvimedu uye CNC yekuchera michina kugadzira maburi madiki kune kukundikana kwakawanda uye kudhura kwakanyanya.
Nokudaro, iyo yakakwirira-density yakadhindwa mapuranga ematunhu anonyanya kugadzirwa netambo dzakanaka uye mapads.Kunyange zvazvo mibairo mikuru yakawanwa, kugona kwavo kunoganhurirwa.Kuti uwedzere kuvandudza kuwanda (zvakadai sematare asingasviki 0.08 mm), mari yacho yakakwira zvakanyanya Saka, micro-pores inoshandiswa kuvandudza densification.
Mumakore achangopfuura, kubudirira kwakaitwa mune tekinoroji yeCNC yekuchera michina uye micro-bits, saka iyo micro-hole tekinoroji yakagadzira nekukurumidza.Ichi ndicho chinhu chikuru chakatanhamara mune yazvino PCB kugadzirwa.
Mune ramangwana, tekinoroji yekugadzira madiki-makomba anozonyanya kuvimba nemichina yekuchera CNC yepamusoro uye yakanaka madiki-misoro.Iwo maburi madiki akaumbwa nelaser tekinoroji achiri akaderera kune makomba madiki akaumbwa neCNC yekuchera michina kubva pakuona kwemutengo uye gomba mhando.
①CNC yekuchera muchina
Parizvino, CNC yekuchera muchina tekinoroji yakaita budiriro nyowani uye kufambira mberi.Uye yakagadzira chizvarwa chitsva cheCNC yekuchera muchina unozivikanwa nekuchera maburi madiki.
Kubudirira kwekuchera makomba maduku (pasi pe 0.50mm) mumakina ekuchera maduku ane 1 nguva yakakwirira kudarika yemazuva ose eCNC drilling machines, ane kukundikana kuduku, uye kumhanya ndeye 11-15r / min;0.1-0.2mm maburi madiki anogona kucherwa.Chibooreso chemhando yepamusoro chemhando yepamusoro chinogona kucherwa nekuturika mahwendefa matatu (1.6mm/chidimbu).
Kana chiboorero chaputsika, chinogona kumira otomatiki uye kuudza chinzvimbo, chobva chatsiva chibhorani uye chekutarisa dhayamita (raibhurari yezvishandiso inogona kugarisa mazana ezvimedu), uye inokwanisa kudzora otomatiki chinhambwe uye kudzika kudzika kwechibooreso uye. chivharo chivharo, kuitira kuti mapofu mapofu anogona kudonha , Haazodhiri tafura.
Tafura yeCNC yekuchera muchina inotora mhepo cushion uye magineti levitation mhando, inofamba nekukurumidza, yakareruka uye nemazvo pasina kukwenya tafura.Michina yekuchera yakadai parizvino yakakurumbira, seMega 4600 kubva kuPrurite kuItari, Excellon 2000 yakatevedzana muUnited States, uye zvigadzirwa zvechizvarwa chitsva seSwitzerland neGermany.
②Kune zvechokwadi matambudziko mazhinji nelaser kuchera akajairwa CNC yekuchera michina uye mabheti ekuboora maburi madiki.Izvo zvakatadzisa kufambira mberi kweiyo micro-hole tekinoroji, saka kukukurwa kwelaser kwakagamuchira kutariswa, kutsvagisa uye kushandisa.
Asi pane chikanganiso chinouraya, ndiko kuti, kuumbwa kwemakomba enyanga, iyo inova yakakomba sezvo kukora kwebhodhi kunowedzera.Yakabatana nehupamhi hwekushisa ablation kusvibiswa (kunyanya mabhodhi e-multi-layer board), hupenyu nekugadzirisa kwezviedza zvechiedza, kudzokorora kurongeka kwemakomba akaiswa, uye mari, kusimudzirwa nekushandiswa kwema microholes mumabhodhi akadhindwa zvishoma.
Nekudaro, maburi elaser etched maburi achiri kushandiswa mutete-high-density microplates, kunyanya muMCM-L yakakwira-density interconnect (HDI) tekinoroji, senge polyester film etched maburi uye kuiswa kwesimbi muMCMS (Sputtering tekinoroji) inoshandiswa pamwe chete nepamusoro. -density interconnects.
Kuumbwa kwemakomba akavigwa mu-high-density interconnected multilayer board ane akavigwa uye mapofu maburi maumbirwo anogona kushandiswa zvakare.Nekudaro, nekuda kwebudiriro uye tekinoroji yeCNC yekuchera michina uye micro-drills, ivo vakakurumidza kusimudzirwa uye kuiswa.
Naizvozvo, kushandiswa kwelaser drilling mupamusoro mount redunhu mabhodhi hakugone kuumba chinzvimbo chikuru.Asi pachine nzvimbo mune imwe nzvimbo.
③ kuvigwa, bofu, kuburikidza-gomba tekinoroji yakavigwa, bofu, kuburikidza-gomba musanganiswa tekinoroji zvakare inzira yakakosha yekuwedzera kuwanda kwemaseketi akadhindwa.
Kazhinji, makomba akavigwa nemapofu maburi madiki.Kuwedzera kuwedzera nhamba wiring pabhodhi, akavigwa uye mapofu makomba anoshandisa "pedyo" inter-layer interconnection, iyo inoderedza zvikuru nhamba kuburikidza nemakomba akaumbwa uye yokuzviparadzanisa ndiro yokugadza achavawo zvikuru Kuderedza, nokudaro kuwedzera nhamba yeanoshanda wiring uye inter-layer interconnections mubhodhi, uye kuwedzera kuwanda kwekubatanidza.
Naizvozvo, iyo yakawanda-layer board yakasanganiswa nekuvigwa, bofu, uye kuburikidza-maburi ine interconnection density inokwana katatu kupfuura iyo yeyakajairwa yakazara-kuburikidza-gomba bhodhi chimiro pakukura kwakafanana uye nhamba yezvidimbu.Kana yakavigwa, mapofu, uye Saizi yebhodhi rakadhindwa rakasanganiswa nemaburi richadzikiswa zvakanyanya kana huwandu hwematanho huchadzikiswa zvakanyanya.
Naizvozvo, mumabhodhi akadhindwa akakwira-density pamusoro-akaiswa, akavigwa uye mapofu maburi tekinoroji ari kuwedzera kushandiswa, kwete chete mupamusoro-akaiswa mabhodhi akadhindwa mumakomputa makuru uye midziyo yekutaurirana, asiwo mumagariro uye maindasitiri ekushandisa.Yakave ichishandiswa zvakanyanya mumunda, kunyangwe mune mamwe matete mabhodhi, akadai akasiyana PCMCIA, Smart, IC makadhi uye mamwe matete matanhatu-layer board.
Iwo akadhindwa edunhu mabhodhi ane akavigwa uye mapofu maburi maumbirwo anowanzo kupedzwa ne "sub-board" nzira yekugadzira, zvinoreva kuti inogona kupedzwa mushure meakawanda ekutsikirira mahwendefa, kudhirowa, gomba plating, nezvimwe, saka kunyatsomira kwakakosha kwakakosha.